Die Bonders, Flip Chip Bonders & Rework Equipment

Finetech high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications.

SW Systems is a Finetech die bonding equipment / flip chip bonding equipment and rework equipment sales representative company that cover the states of Texas, Oklahoma, Arkansas and Louisiana. We also cover the country of Mexico.

Die Bonding & PCB Rework Equipment

 

Bonding & Rework Equipment News

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We proudly represent the world's best equipment, machines and materials for semiconductor, PCB assembly & final electro-mechanical assembly