Semiautomatic Hybrid Rework Station for Small Boards – EXPERT 10.6 IV

Semiautomatic Hybrid Rework Station for Small Boards – EXPERT 10.6 IV

Semiautomatic hybrid Rework station with adjustable heating system for the repair of small circuit boards, such as those found in smartphones.

410 W Rework station with IR under-heating system (80 x 60 mm²) and automated SMD placement process by Auto Vision Placer (AVP) incl. software EASYSOLDER 07 and DBL 06 control unit with six high-resolution sensors inputs for thermocouples (Type K). This unit is particularly suitable for small PCBs found in smartphones and PDAs with fine-pitch components in varying package dimensions.

Standard equipment

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
  • Set of soldering nozzles (CSP/QFN), 9 mm, 11 mm 13 mm, 16 mm
  • Set of soldering nozzles (SO) 10×15 mm², 15×25 mm²
  • Placement nozzle for manual placement of small components (0,5 mm)
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Two PCB magnet holder 40.5 mm (standard)
  • PCB support rail 40.5 mm
  • Two PCB clips to install at hand rest
  • Foot switch
  • Manual
  • Intuitive software EASYSOLDER 07 with touch integration

Processes

  • Dipping
  • Paste printing
  • Solder removal
  • Soldering
  • Desoldering
  • Reballing
  • Dispensing

Components

  • LED rework
  • Daughter boards
  • Interposer boards
  • Sub assemblies
  • RF frames
  • RF shields
  • Rework on flex
  • Small passives down to 0402
  • SON
  • PGA
  • QFP
  • PoP
  • DFN
  • QFN
  • µBGA/CSP
  • BGA
  • Sockets
  • Connectors
  • CPU
  • Underfiller or coated components
  • Film capacitor

Technical details

Power consumption: 1000 VA
Power solder pen: 300 W, 35 l/min
Power under-heating system: 110 W, 2 x IR-lamps
Size under-heating system: 80 x 60 mm²
Max. PCB size: 100 x 80 mm²
Resolution motion system: 0,001 mm
Placement accuracy: ± 0,015 mm (Flip Chip)*
± 0,030 mm (CSP)
± 0,040 mm (BGA)
High resolution CMOS-camera: 5 Mio. Pixel, USB2
Size of component:
Lens X Y
Flip Chip* min.

max.

0.2 mm

15 mm

x

x

0.2 mm

12 mm

CSP min.

max.

0.5 mm

35 mm

x

x

0.5 mm

25 mm

BGA min.

max.

1 mm

45 mm

x

x

1 mm

35 mm

Maxi BGA* min.

max.

2 mm

70 mm

x

x

2 mm

55 mm

Mains: 1 Phase, 230VAC, Fuse 16A
Pressurized air: 5-8 bar, 100 l/min clean, dry air
Dimensions: 865 x 460 mm²
Weight: 70 kg
* Optional extras